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Signal Integrity Analysis of Biodegradable Stretchable Interconnect for Wearable Application

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dc.contributor.affiliationDA-IICT, Gandhinagar
dc.contributor.authorBhatti, Gulafsha
dc.contributor.authorMaru, Devkaran
dc.contributor.authorPatle, Kamlesh
dc.contributor.authorShah, Kinnaree
dc.contributor.authorPalaparthy, Vinay
dc.contributor.authorAgrawal, Yash
dc.date.accessioned2025-09-16T10:33:20Z
dc.date.issued01-07-2025
dc.identifier.citationGulafsha Bhatti, Devkaran Maru, Kamlesh Patle, Kinnaree Shah, Vinay Palaparthy, and Yash Agrawal, "Signal Integrity Analysis of Biodegradable Stretchable Interconnect for Wearable Application," IEEE Sensors Letters, IEEE, ISSN: 2475-1472, vol. 09, no.07, Jul. 2025, Art no. 5502104, pp. 1-4, doi: 10.1109/LSENS.2025.3573885.
dc.identifier.doi10.1109/LSENS.2025.3573885
dc.identifier.issn2475-1472
dc.identifier.urihttps://ir.daiict.ac.in/handle/dau.ir/2158
dc.language.isoen
dc.publisherIEEE
dc.sourceIEEE Sensors Letters
dc.source.urihttps://ieeexplore.ieee.org/document/11015767
dc.titleSignal Integrity Analysis of Biodegradable Stretchable Interconnect for Wearable Application
dspace.entity.typePublication
relation.isAuthorOfPublicationdbe8164f-7d10-44b4-9b2a-88bf75fb926e
relation.isAuthorOfPublication3cc1160e-2d03-49ec-842b-cc76c6d35776
relation.isAuthorOfPublication.latestForDiscoverydbe8164f-7d10-44b4-9b2a-88bf75fb926e

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